Very fast response time RoHS compliant
Excellent clamping capability Glass passivated chip
8000 W peak pulse power capability with a
10/1000 ȝs waveform, repetitive rate (duty cycle):0.01 %
Meet AEC-Q101 requirement Low leakage
Uni-directional polarity >>>>>>>>(T A =25ɗ unless otherwise noted)
Electrical Characteristics NOTE: Surge current waveform is defined at 10/1000uS waveform
01
|spsemi
Mechanical Data
Epoxy: UL 94V-0 rate flame retardant Polarity: Heatsink is anode
>>>IEC Compatibility
Plastic package
ISO 16750-2 Test A 12v System
( 100V 1 400ms 10c ) 24v System (174V 4 350ms 10c)
ΩΩ>DO-218AB/SOD-BLOCK
REV.2016.01.04
02 | spsemi
AMBIEN AVERAGE FORWARD CURRENT, (A)0
10025
100175
000.2##0.5761501.533223313410
Fig. 3 - Steady State Power Derating Curve
Fig. 2 - Pulse Waveform
(T A =25ɗ unless otherwise noted)
Fig. 1 - Pulse Derating Curve
Fig. 4 - Peak Pulse Power Rating Curve
025
50
75
1000
25
50
75
100
125
150
175
200
P e a k P u l s e D e r a t i n g i n P e r c e n t a g e o f P e a k
P o w e r o r C u r r e n t , (%)
Ambient Temperature ,T A (ɗ)
050
1000
1
23
4
P
e a k P u l s e C u r r e n t , (% )
Time , (ms)
10/1000 ȝsec. Waveform
Peak Value (Ipp)td
T r =10ȝs
Half Value = Ipp
2
T J = 25 ƱC
Pulse Width (td) is defined as the
point where the peak current decays to 50 % of Ipp
Note:
(T A =25ɗ unless otherwise noted)
Parameter
Symbol
Value UNIT Peak power dissipation with a 10/1000ȝs waveform (1)P PP
8000W Peak pulse current wih a 10/1000ȝs waveform (1)
I PP See above Table Power dissipation on infinite heatsink at T L = 25 °C D 5.0W Peak forward surge current 8.3 ms single half sine-I FSM 500A Operating junction and storage temperature range T J , T STG –55 to +175
°C
(1)Non-repetitive current pulse per Fig.2 and derated above T A = 25 °C per Fig.1
P x Ma imum Ratings Ratings and Characteristics Curves A
REV.2016.01.04
03 | spsemi
Fig. 6 Ri-Vs chart for ISO-16750-2 Test A : 24V System
Fig. 5 Ri-Vs chart for ISO-16750-2 Test A : 12V System
(millimeters)
PACKAGE OUTLINE DIMENSIONS
REV.2016.01.04
150ɗ200ɗ60-180
sec <3
ɗ/sec >220
ɗ255-260
sec 60-150
sec <3
ɗ/sec 10-30
sec <5ɗ/sec <6njo 280
ɗ
Do not exceed
Ramp up rate (150-200ɗ)
Reflow
Liquidus Temp.Peak Temp.Time(Liq. to Peak)Ramp up rate (220-200ɗ)Time within actual peak temp.Ramp down Rate Time(25ɗ to Peak temp.)
Pre Heat
Temp. min
Temp. max
Time(min to max)IR-Reflow Condition t p
t s
Perheat
T s(min)
T s(max)
T L t L
T P
Ramp-up
Time(t)
Temp from 25 °C to Peak
T e m p e r a t u r e (T )
AUTO TVS/ASB Series 04 | spsemi
Recommended Soldering Parameters
B MIN.
C
1.5 (0.059)13.0 ± 0.20
(0.51 ±
0.0008)
G MAX.
26.4 (1.039)
T MAX.30.4(1.197)
TAPE SIZE
24 mm (0.945)
A MAX.
330 ± 2.0 (13.0 ±
0.079)
178 ± 2.0 (7.0 ±
0.079)
DIMENSIONS in millimeters (inches)
D MIN.20.2
(0.795)
N MIN.
50 (1.97)B
D
C
ZONE 1
ZONE1
A
N G
T
SURFACE MOUNT TAPE AND REEL PACKAGING
REV.2016.01.04
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